JPH0723965Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH0723965Y2
JPH0723965Y2 JP12545589U JP12545589U JPH0723965Y2 JP H0723965 Y2 JPH0723965 Y2 JP H0723965Y2 JP 12545589 U JP12545589 U JP 12545589U JP 12545589 U JP12545589 U JP 12545589U JP H0723965 Y2 JPH0723965 Y2 JP H0723965Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating substrate
insulating
recess
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12545589U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363945U (en]
Inventor
博司 土岐
達海 坂元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP12545589U priority Critical patent/JPH0723965Y2/ja
Publication of JPH0363945U publication Critical patent/JPH0363945U/ja
Application granted granted Critical
Publication of JPH0723965Y2 publication Critical patent/JPH0723965Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP12545589U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH0723965Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12545589U JPH0723965Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12545589U JPH0723965Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363945U JPH0363945U (en]) 1991-06-21
JPH0723965Y2 true JPH0723965Y2 (ja) 1995-05-31

Family

ID=31673325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12545589U Expired - Lifetime JPH0723965Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0723965Y2 (en])

Also Published As

Publication number Publication date
JPH0363945U (en]) 1991-06-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term